908E621_07 Datasheet, PDF (6/62 Pages) Freescale Semiconductor, Inc – Integrated Quad Half-Bridge and Triple High-Side with Embedded MCU and LIN for High End Mirror

MAXIMUM RATINGS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent
damage to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
V
Analog Chip Supply Voltage under Normal Operation (Steady-State)
V_SUP(SS)
-0.3 to 28
Analog Chip Supply Voltage under Transient Conditions ⁽¹⁾
V_SUP(PK)
-0.3 to 40
MCU Chip Supply Voltage
V_DD
-0.3 to 5.5
Input Terminal Voltage
Analog Chip
Microcontroller Chip
V
V_{IN (ANALOG)}
-0.3 to 5.5
V_{IN (MCU)}
V_SS-0.3 to V_DD+0.3
Maximum Microcontroller Current per Terminal
All Terminals except VDD, VSS, PTA0:PTA4
PTA0:PTA4
I_PIN(1)
I_PIN(2)
mA
±15
± 25
Maximum Microcontroller VSS Output Current
Maximum Microcontroller VDD Input Current
LIN Supply Voltage
Normal Operation (Steady-State)
Transient Input Voltage (per ISO7637 Specification) and with
External Components (Figure 4, page 18)
ESD Voltage ⁽²⁾
Human Body Model H0 terminal
Human Body Model all other terminals
Machine Model
Charge Device Model
I_MVSS
I_MVDD
V_BUS(SS)
V_BUS(PK)
V_ESD1-1
V_ESD1-2
V_ESD2
V_ESD3
100
mA
100
mA
V
-18 to 40
-150 to 100
V
±1000
±2000
±200
± 750
Notes
1. Transient capability for pulses with a time of t < 0.5 sec.
2. ESD1 testing is performed in accordance with the Human Body Model (C_ZAP = 100 pF, R_ZAP = 1500 Ω), the Machine Model
(C_ZAP =200 pF, R_ZAP = 0 Ω) and the Charge Device Model, Robotic (C_ZAP = 4.0 pF).
908E621
6
Analog Integrated Circuit Device Data
Freescale Semiconductor