I.MX27 Datasheet, PDF (42/148 Pages) Freescale Semiconductor, Inc – Multimedia Applications Processor

Electrical Characteristics
4.1.2 Current Consumption
Table 10 defines the frequency settings used for specifying power consumption in Table 11. All power
states are specified. The temperature setting of 25° C is used for specifying the Deep Sleep Mode (DSM)
per the temperature range shown in Table 7.
Table 10. Frequency Definition for Power Consumption Measurement
ID
Parameter
1 MCU core
2 MCU core
3 MCU AHB bus
4 MCU IP bus
5 OSC32
Symbol
f_MCUmeas@266
f_MCUmeas@400
f_MCU-AHBmeas
f_MCU-IPmeas
f_osc32khzmeas
Value
266
400
133
66
32.768
Units
MHz
MHz
MHz
MHz
kHz
Table 11 shows the power consumption for the i.MX27/iMX27L device.
Table 11. Current Consumption
ID
Parameter
Conditions
1
RUN Current RUN Current at 266 MHz
(QV_DD current) _{QVDD = 1.3 V. Ta = 25}^o_C
RUN Current at 400 MHz
QV_DD = 1.45 V, Ta = 25^oC
2
Doze Current • QV_DD = 1.2 V
• NV_DD = 1.75 V
• ARM is in wait for interrupt mode.
• ARM well bias is enabled.
• MCU PLL is on.
• SPLL is off.
• FPM is on.
• 26MHz oscillator is on.
• 32 kHz oscillator is on.
• Other modules are off.
• T_A = 25° C.
3
Sleep Current • QV_DD = 1.2 V.
• NV_DD = 1.75 V.
• Both PLLs are off.
• FPM is off.
• ARM well bias is enabled.
• 32 kHz oscillator is on.
• 26MHz oscillator is off.
• All the modules are off.
• T_A = 25° C.
4
Power Gate • NV_DD13 is on. See Table 7 for specific values.
• RTC_VDD, OSC32_VDD are on. See Table 7 for specific
values.
• All other V_DD = 0 V
• T_A = 25° C.
Symbol
Idd_RUN
Typical
215
Idd_RUN
366
Idd_DOZE
11
Max
260
420
13.5
Units
mA
mA
mA
Idd_SLEEP
0.9
3.5
mA
Idd_PG
50
TBD
µA
i.MX27 and i.MX27L Data Sheet, Rev. 1.5
42
Freescale Semiconductor