I.MX27 Datasheet, PDF (106/148 Pages) Freescale Semiconductor, Inc – Multimedia Applications Processor

Package Information and Pinout
5.2 Pin Assignments (17 mm × 17 mm)
Table 59 on page 107 shows the i.MX27 full 17 × 17 mm package MAPBGA pin assignments.
Table 60 on page 112 identifies the pin assignments for the ball grid array (BGA) for full package. The
list is sorted alphabetically by the name of the contact. The connections of these pins depend solely upon
the user application, however there are a few factory test signals that are not used in a normal application.
Following is a list of these signals and how they are to be terminated for proper operation of the
i.MX27/MX27L processor:
• CLKMODE[1:0]: To ensure proper operation, leave these signals as no connects.
• OSC26M_TEST: To ensure proper operation, leave this signal as no connect.
• EXT_60M: To ensure proper operation, connect this signal to ground.
• EXT_266M: To ensure proper operation, connect this signal to ground.
• Most of the signals shown in Table 59 are multiplexed with other signals. For ease of reference, all
of the signals at a particular pad are shown in the form of a compound signal name. Please refer to
Table 3 for complete information on the signal multiplexing schemes of these signals.
i.MX27 and i.MX27L Data Sheet, Rev. 1.5
106
Freescale Semiconductor