|
S9S12G128F0MLH Datasheet, PDF (1192/1292 Pages) Freescale Semiconductor, Inc – S12 CPU core, Up to 240 Kbyte on-chip flash with ECC | |||
|
◁ |
Electrical Characteristics
A.1.5 Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima
is not guaranteed. Stress beyond those limits may affect the reliability or cause permanent damage of the
device.
This device contains circuitry protecting against damage due to high static voltage or electrical ï¬elds;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either VSS35 or VDD35).
Table A-1. Absolute Maximum Ratings1
Num
Rating
Symbol
Min
1 I/O, regulator and analog supply voltage
2 Voltage difference VDDX to VDDA
3 Voltage difference VSSX to VSSA
4 Digital I/O input voltage
5 Analog reference
6 EXTAL, XTAL
7 Instantaneous maximum current
Single pin limit for all digital I/O pins2
VDD35
âVDDX
âVSSX
VIN
VRH
VILV
ID
â0.3
â6.0
â0.3
â0.3
â0.3
â0.3
â25
8 Instantaneous maximum current
Single pin limit for EXTAL, XTAL
IDL
â25
9 Maximum current
Single pin limit for power supply pins
IDV
â60
10 Storage temperature range (M, V, C, and W temperature range)
Tstg
â65
1 Beyond absolute maximum ratings device might be damaged.
2 All digital I/O pins are internally clamped to VSSX and VDDX, or VSSA and VDDA.
Max
Unit
6.0
V
0.3
V
0.3
V
6.0
V
6.0
V
2.16
V
+25
mA
+25
mA
+60
mA
155
°C
A.1.6 ESD Protection and Latch-up Immunity
All ESD testing is in conformity with CDF-AEC-Q100 stress test qualiï¬cation for automotive grade
integrated circuits. During the device qualiï¬cation ESD stresses were performed for the Human Body
Model (HBM) and the Charge Device Model.
A device will be deï¬ned as a failure if after exposure to ESD pulses the device no longer meets the device
speciï¬cation. Complete DC parametric and functional testing is performed per the applicable device
speciï¬cation at room temperature followed by hot temperature, unless speciï¬ed otherwise in the device
speciï¬cation.
1194
MC9S12G Family Reference Manual, Rev.1.23
Freescale Semiconductor
|
▷ |