LM3S101_0610 Datasheet, PDF (294/300 Pages) List of Unclassifed Manufacturers – Microcontroller

Package Information
18 Package Information
Figure 18-1. 28-Pin SOIC Package
NOTES:
1. Dimension “D” does not include mold flash, protrusions, or gate burrs.
MOld flash, protrusions, and gate burrs shall not exceed .006”
(0.15mm) per side.
2. Dimension “E” does not include inter-lead flash or protrusions. Inter-
lead flash and protrusion shall not exceed “.010” (0.25 mm) per side.
3. “L” is the length of terminal for soldering to a substrate.
4. “N” is the number of terminal positions.
5. Terminal numbers are shown for reference only.
6. The lead width “b”, as measured .014” (0.36 mm) or greater above
the seating plane, shall not exceed a maximum value of .024” (0.61
mm).
7. Reference drawing JEDEC MS013, Variation AE.
DIMENSION IN INCH DIMENSION IN MM
SYMBOL
MIN
MAX
MIN
MAX
A
.093
.014
2.35
2.65
A1
.004
.012
0.10
0.30
B
.013
.020
0.33
0.51
C
.009
.013
0.23
.032
D
.696
.713
17.70 18.10
E
.291
.299
7.40
7.60
e
0.50 BSC
1.27 BSC
H
.394
.419
10.00 10.65
h
.010
.029
0.25
0.75
L
.016
.050
0.40
1.27
S
.021
.031
0.533 .0787
α
0°
8°
0°
8°
294
October 5, 2006
Preliminary