English
Language : 

M12L2561616A_1 Datasheet, PDF (14/45 Pages) Elite Semiconductor Memory Technology Inc. – 4M x 16 Bit x 4 Banks Synchronous DRAM
ESMT
Write command
( CS , CAS , WE = Low, RAS = High)
If the mode register is in the burst write mode, this command sets the burst start
address given by the column address to begin the burst write operation. The first
write data in burst can be input with this command with subsequent data on following
clocks.
M12L2561616A
CLK
CKE
H
CS
RAS
CAS
WE
BA0,BA1
(Bank select)
A10
Add
Col.
Fig. 4 Column address and
write command
Read command
( CS , CAS = Low, RAS , WE = High)
Read data is available after CAS latency requirements have been met.
This command sets the burst start address given by the column address.
CLK
CKE
H
CS
RAS
CAS
WE
BA0,BA1
(Bank select)
A10
Add
Col.
Fig. 5 Column address and
read command
CBR (auto) refresh command
( CS , RAS , CAS = Low, WE , CKE = High)
This command is a request to begin the CBR refresh operation. The refresh
address is generated internally.
Before executing CBR refresh, all banks must be precharged.
After this cycle, all banks will be in the idle (precharged) state and ready for a
row activate command.
During tRC period (from refresh command to refresh or activate command), the
M12L2561616A cannot accept any other command.
CLK
CKE
H
CS
RAS
CAS
WE
BA0,BA1
(Bank select)
A10
Add
Fig. 6 Auto refresh command
Elite Semiconductor Memory Technology Inc.
Publication Date: Jun. 2008
Revision: 1.4
14/45