E981.03 Datasheet, PDF (5/51 Pages) ELMOS Semiconductor AG – Autonomous MAC and individual physical address

KNX/ EIB TRANSCEIVER
PRODUCTION DATA - JAN 15, 2015
E981.03
Description
Condition Symbol
Min
Typ
Max Unit
20V load current, this current is positive from
the supply to the output
I ⁸⁾
V20
0
V_CC output capacitance
V_CC output capacitance
C_VCC equivalent series resistance
C_VCC equivalent series resistance
L_SPS=330µH C_VCC,L330µ
10
L_SPS=1000µH C_{VCC,L1000µ}
68
L_SPS=330µH ²⁾ R_{ESR,CVCC,L330µ} 0.2
L_2)SPS=1000µH _{RESR,CVCC, L1000µ 1}
20
mA
47
0.6 · C_ST µF
100
0.6 · C_ST µF
0.5
0.8
Ω
1.25 1.5
Ω
Ceramic capacitance V_CC to ground
DC / DC converter inductance
L_SPS series resistance
Saturation current of L_SPS
Maximum forward voltage of the external
diode
3)
I=150mA
C_CVCC
L_SPS
R_L,SPS
I_sat,SPS
V_f,DSPS
80
100
120
nF
270
330
1200 µH
1
3
10
Ω
160
mA
0.6
1
V
Reverse recovery time of the external diode
Vpo_CCsliotiavde
current in 3.3 V mode,
from the supply to the
this current
output
is
L_SPS=330µH
t_rr,DSPS
I ⁸⁾
VCC3.3,L330µ
0
Vpo_CCsliotiavde
current in 3.3 V mode,
from the supply to the
this current
output
is
L_SPS=1000µH
I ⁸⁾
VCC3.3,L1000µ
0
50
ns
50
mA
70
mA
V_CC load current in 5V mode, this current is
positive from the supply to the output
L_SPS=330µH
I ⁸⁾
VCC5,L330µ
0
30
mA
Vpo_CCsliotiavde
current in 5V mode, this current
from the supply to the output
is
Digital IO interface voltage ⁶⁾
Digital IO interface voltage ⁶⁾
Crystal frequency (+- 50 ppm)
Synchronization clock frequency applied at
pin XTAL
L_SPS=1000µH
I ⁸⁾
VCC5,L1000µ
V_IO,norm=5V
V_IO,norm=3.3V
no crystal in-
stalled
V_IO,5
V_IO,33
f_Q
f _XTAL,sync
0
70
mA
4.75
5.25 V
3.15
3.45 V
7.3728
MHz
126.537 126.562 126.588 Hz
Receiver decoupling capacitance
C_CREC
50
56
62
nF
External send resistance
R_TX
44.5 47
49.4 Ω
External send resistor power dissipation ¹⁾
P_RTX
1
W
System level ESD protection resistance ⁵⁾
R_SET; R_VCC
1
kΩ
System level ESD protection zener-diode ⁵⁾
V_zDiode
6.2
V
Analog monitor (AOUT - pin) current
I_AOUT
-50
50
µA
External send pull-down
R_TXL
9
10
11
kΩ
1) For telegram rates > 50% P_RTX = 2 W is recommended.
2) The lower limit is necessary for DC/ DC control.
The upper limit is a result of ripple considerations: voltage ripple is ESR * current ripple of LSPS.
To guarantee this over lifetime it is useful to use a low ESR capacitor and realize the lower limit with a series resistor.
3) I_sat,SPS is the DC current that causes an inductance drop of 20 %.
4) Smaller C_ST down to 47 µF can be used, however the load step capability has to be proved experimentally.
5) Only necessary in case of the E981.03 being connected to a separate application module.
These components only ensuring to meet the absolute maximum rating in case of connecting and disconnecting the
application module. If the connector guarantees to connect GND potential first, the ESD protection is not needed.
6) For better elaboration of the ADC results a stable VIO is highly recommended.
7) High capacitance may affect the Reset / Power up Sequence time, as it is loaded with current limitation I . _V20(max)
8) To use the maximum current capability on VCC and V20 it is needed to change MAX_BUS_CURR settings before switching on
high current consumption. Additionally a continuous under voltage condition on BUSP could reduce available current. To
prevent unexpected under voltage conditions it is strongly recommended to observe VVST and implement a power
management system. The voltage VVST could be observed ADC converted trough UART or SPI.
For details read chapter 6.3 and 10.2.
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Elmos Semiconductor AG
Data Sheet
QM-No.: 25DS0046E.03
5/51