BCM4319XKUBGT Datasheet, PDF (83/84 Pages) Cypress Semiconductor – Single-Chip IEEE 802.11™ a/b/g/n MAC/Baseband/ Radio with Integrated SDIO and USB Interfaces

BCM4319 Preliminary Data Sheet
Ordering Information
Section 18: Ordering Information
Table 32: Ordering Information
Part Number
BCM4319GKUBG
BCM4319XKUBG
BCM4319SKUBG
Package
Description
138-ball, wafer-level WLBGA package
(5.74 mm x 4.53 mm x 0.5 mm, 0.4 mm
pitch)
Single-band 802.11b/g/n
2.4GHz WLAN, USB 2.0,
SDIO
138-ball, wafer-level WLBGA package
(5.74 mm x 4.53 mm x 0.5 mm, 0.4 mm
pitch)
Dual-band 802.11a/b/g/n
2.4 GHz and 5 GHz WLAN,
USB 2.0, SDIO
138-ball, wafer-level WLGBA package with Single-band 802.11b/g/n
Back Side Protection (BSP)
2.4 GHz WLAN USB2.0,
(5.74 mm x 4.53 mm x 0.5 mm, 0.4 mm SDIO
pitch)
Ambient
Temperature
–30 °C to
85 °C
–30 °C to
85 °C
–30 °C to
85 °C
Broadcom^®
April 2, 2014 • 4319-DS05-R
Single-Chip IEEE 802.11™ a/b/g/n MAC/Baseband/Radio
Page 82