AK4646EZ Datasheet, PDF (77/78 Pages) Asahi Kasei Microsystems – Stereo CODEC with MIC/SPK-AMP

[AK4646EZ]
32pin QFN (Unit: mm)
PACKAGE
4.0 ± 0.1
A
17
16
2.4 ± 0.1
24
25
0.40 ± 0.10
Exposed
Pad
9
32
0.45 ± 0.10
8
1
B
0.18 ± 0.05
0.05 M
C0.3
PIN #1 ID
0.08
0.4
Note) The exposed pad on the bottom surface of the package must be open or connected to the ground.
When it is open, the maximum operating temperature of the chip periphery is 70°C.
■ Material & Lead finish
Package molding compound:
Lead frame material:
Lead frame surface treatment:
Epoxy
Cu
Solder (Pb free) plate
MS0630-E-00
- 77 -
2007/06