XQV100 Datasheet, PDF (23/31 Pages) Xilinx, Inc – QPro Virtex 2.5V QML

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QPro Virtex 2.5V QML High-Reliability FPGAs
Table 4: Virtex Plastic Ball Grid and Ceramic Column Grid Pinout Information (Continued)
Pin Name
Device
BG256
BG352
BG432
GND
All
C3, C18, D4, A1, A2, A5, A2, A3, A7, A9,
D5, D9, D10, A8, A14, A19, A14, A18, A23,
D11, D12,
A22, A25, A25, A29, A30,
D16, D17. E4, A26, B1, B26, B1, B2, B30,
E17, J4, J17, E1, E26, H1, B31, C1, C31,
K4, K17, L4, H26, N1, P26, D16, G1, G31,
L17, M4, M9, W1, W26,
J1, J31, P1,
M10, M17, AB1, AB26, P31, T4, T28,
T4, T17, U4, AE1, AE26, V1, V31, AC1,
U5, U9, U10, AF1, AF2,
AC31, AE1,
U11, U12,
AF5, AF8, AE31, AH16,
U16, U17, V3, AF13, AF19, AJ1, AJ31,
V18
AF22, AF25, AK1, AK2,
AF26
AK30, AK31,
AL2, AL3, AL7,
AL9, AL14,
AL18, AL23,
AL25, AL29,
AL30
GND⁽¹⁾
No Connect
All
J9, J10, J11,
-
-
J12, K9, K10,
K11, K12, L9,
L10, L11,
L12, M9,
M10,
M11,M12
-
-
-
-
Notes:
1. 16 extra balls (grounded) at package center.
BG560/CG560
A1, A7, A12, A14,
A18, A20, A24,
A29, A32, A33,
B1, B6, B9, B15,
B23, B27, B31,
C2, E1, F32, G2,
G33, J32, K1, L2,
M33, P1, P33,
R32, T1, V33,
W2, Y1, Y33,
AB1, AC32,
AD33, AE2, AG1,
AG32, AH2,
AJ33, AL32,
AM3, AM7,
AM11, AM19,
AM25, AM28,
AM33, AN1, AN2,
AN5, AN10,
AN14, AN16,
AN20, AN22,
AN27, AN33
-
C31, AC2, AK4,
AL3
DS002 (v1.5) December 5, 2001
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Preliminary Product Specification
1-800-255-7778