W25Q256JVEIQ-TR Datasheet, PDF (7/92 Pages) Winbond – 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI

W25Q256JV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q256JV is offered in an 8-pad WSON 8x6-mm (package code E), a 16-pin SOIC 300-mil (package
code F) and two 24-ball 8x6-mm TFBGA (package code B & C) packages as shown in Figure 1a-c
respectively. Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1 Pad Configuration WSON 8x6-mm
Figure 1a. W25Q256JV Pad Assignments, 8-pad WSON 8x6-mm (Package Code E)
3.2 Pad Description WSON 8x6-mm
PAD NO.
1
2
3
4
5
6
7
8
PAD NAME
/CS
DO (IO1)
DO (IO1)
GND
DI (IO0)
CLK
IO3
VCC
I/O
FUNCTION
I
Chip Select Input
I/O
Data Output (Data Input Output 1)⁽¹⁾
I/O
Data Output (Data Input Output 1)⁽¹⁾
Ground
I/O
Data Input (Data Input Output 0)⁽¹⁾
I
Serial Clock Input
I/O
Data Input Output 3⁽²⁾
Power Supply
Notes:
1. IO0 and IO1 are used for Standard and Dual SPI instructions
2. IO0 – IO3 are used for Quad SPI instructions (factory default for Quad Enabled part numbers with ordering option “IQ”)
Publication Release Date: September 20, 2016
-6-
Revision B