W25Q256JVEIQ-TR Datasheet, PDF (4/92 Pages) Winbond – 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI

W25Q256JV
8.2.27
8.2.28
8.2.29
8.2.30
8.2.31
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8.2.33
8.2.34
8.2.35
8.2.36
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8.2.38
8.2.39
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8.2.43
8.2.44
8.2.45
8.2.46
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8.2.48
8.2.49
8.2.50
8.2.51
Sector Erase (20h) .............................................................................................................54
Sector Erase with 4-Byte Address (21h).............................................................................55
32KB Block Erase (52h) .....................................................................................................56
64KB Block Erase (D8h).....................................................................................................57
64KB Block Erase with 4-Byte Address (DCh) ...................................................................58
Chip Erase (C7h / 60h).......................................................................................................59
Erase / Program Suspend (75h) .........................................................................................60
Erase / Program Resume (7Ah) .........................................................................................61
Power-down (B9h) ..............................................................................................................62
Release Power-down / Device ID (ABh) .............................................................................63
Read Manufacturer / Device ID (90h) .................................................................................64
Read Manufacturer / Device ID Dual I/O (92h) ...................................................................65
Read Manufacturer / Device ID Quad I/O (94h) .................................................................66
Read Unique ID Number (4Bh)...........................................................................................67
Read JEDEC ID (9Fh) ........................................................................................................68
Read SFDP Register (5Ah) ................................................................................................69
Erase Security Registers (44h)...........................................................................................70
Program Security Registers (42h) ......................................................................................71
Read Security Registers (48h) ...........................................................................................72
Individual Block/Sector Lock (36h) .....................................................................................73
Individual Block/Sector Unlock (39h) ..................................................................................74
Read Block/Sector Lock (3Dh) ...........................................................................................75
Global Block/Sector Lock (7Eh)..........................................................................................76
Global Block/Sector Unlock (98h).......................................................................................76
Enable Reset (66h) and Reset Device (99h) ......................................................................77
9. ELECTRICAL CHARACTERISTICS............................................................................................... 78
9.1 Absolute Maximum Ratings ⁽¹⁾ .......................................................................................... 78
9.2 Operating Ranges............................................................................................................... 78
9.3 Power-up Power-down Timing and Requirements ............................................................. 79
9.4 DC Electrical Characteristics .............................................................................................. 80
9.5 AC Measurement Conditions.............................................................................................. 81
9.6 AC Electrical Characteristics⁽⁶⁾ ........................................................................................... 82
9.7 AC Electrical Characteristics (cont’d) .............................................................................. 83
9.8 Serial Output Timing ........................................................................................................... 84
9.9 Serial Input Timing.............................................................................................................. 84
9.10 PACKAGE SPECIFICATIONs ............................................................................................ 85
9.11 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 85
9.12 16-Pin SOIC 300-mil (Package Code F) ............................................................................ 86
9.13 24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 Ball Array) ........................................... 87
9.14 24-Ball TFBGA 8x6-mm (Package Code C, 6x4 Ball Array) .............................................. 88
9.15 Ordering Information........................................................................................................... 89
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