W25Q256JVEIQ-TR Datasheet, PDF (69/92 Pages) Winbond – 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI

W25Q256JV
8.2.41 Read JEDEC ID (9Fh)
For compatibility reasons, the W25Q256JV provides several instructions to electronically determine the
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin low
and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh) and
two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling
edge of CLK with most significant bit (MSB) first as shown in Figure 50. For memory type and capacity
values refer to Manufacturer and Device Identification table.
/CS
CLK
DI
(IO₀)
DO
(IO₁)
/CS
CLK
Mode 3
Mode 0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Instruction (9Fh)
* ^{= MSB}
High Impedance
Manufacturer ID (EFh)
15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
Mode 3
Mode 0
DI
(IO₀)
DO
(IO₁)
Memory Type ID15-8
Capacity ID7-0
7654321076543210
*
*
Figure 50. Read JEDEC ID Instruction
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Publication Release Date: September 20, 2016
Revision B