LP3918 Datasheet, PDF (5/39 Pages) National Semiconductor (TI) – Battery Charge Management and Regulator Unit

LP3918
www.ti.com
LDO
1
CORE
2
DIGI
3
ANA
4
TCXO
5
RX
6
TX
7
GP
SNVS476D – AUGUST 2007 – REVISED MAY 2013
Table 2. LDO Output Voltages Selectable via Serial Interface
mA 1.5 1.8 1.85 2.5 2.6 2.7 2.75 2.8 2.85 2.9 2.95 3.0 3.05 3.1 3.2 3.3
300 + +
+
+++++++++++++
300
+++++++++++++
80
++++++++
80 + +
+
+++++++++++++
150
++++++++
150
++++++++
150 + +
+
+++++++++++++
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ^{(1) (2)(3)}
CHG-IN,
VBATT =VIN1/2, BATT,HF_PWR
All other Inputs
Junction Temperature (T_J-MAX)
Storage Temperature
Max Continuous Power Dissipation⁽⁴⁾
(P_D-MAX) ⁽⁵⁾
ESD ⁽⁶⁾
Batt, VIN1, VIN2, HF_PWR, CHG_IN, PWR_ON
All other pins
−0.3 to +6.5V
−0.3 to +6V
−0.3 to V_BATT +0.3V, max 6.0V
150°C
−40°C to +150°C
Internally Limited
8kV HBM
2kV HBM
(1) All voltages are with respect to the potential at the GND pin.
(2) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test
conditions, see the Electrical Characteristics tables.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) Care must be exercised where high power dissipation is likely. The maximum ambient temperature may have to be derated. Like the
Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. In
applications where high power dissipation and/or poor thermal dissipation exists, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T_{A_MAX}) is dependent on the maximum power dissipation of the device in the application
(P_{D_MAX}), and the junction to ambient thermal resistance of the device/package in the application (θ_JA), as given by the following
equation:T_{A_MAX} = T_{J_MAX-OP} – (θ_JA X P_DMAX )
(5) Internal Thermal Shutdown circuitry protects the device from permanent damage.
(6) The human-body model is 100pF discharged through 1.5kΩ. The machine model is a 200pF capacitor discharged directly into each pin,
MIL-STD-883 3015.7.
Operating Ratings ⁽¹⁾⁽²⁾
CHG_IN
4.5 to 6.0V
VBATT =VIN1/2, BATT
3.0 to 5.5V
HF_PWR, PWR_ON
0V to 5.5V
ACOK_N, SDA, SCL, RX_EN, TX_EN, TCXO_EN, PS_HOLD, RESET_N
All other pins
Junction Temperature (T_J)
Ambient Temperature (T_A)
0V to (V_LDO2 + 0.3V)
0V to (V_BATT + 0.3V)
−40°C to +125°C
-40 to 85°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pin.
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