CC430F6147_15 Datasheet, PDF (81/118 Pages) Texas Instruments – MSP430 SoC With RF Core

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ECCN 5E002 TSPA - Technology / Software Publicly Available
CC430F614x
CC430F514x
CC430F512x
SLAS555A – NOVEMBER 2012 – REVISED FEBRUARY 2013
Frequency Synthesizer Characteristics
T_A = 25°C, V_CC = 3 V (unless otherwise noted)⁽¹⁾
MIN figures are given using a 27-MHz crystal. TYP and MAX figures are given using a 26-MHz crystal.
PARAMETER
Programmed frequency resolution⁽²⁾
Synthesizer frequency tolerance⁽³⁾
TEST CONDITIONS
26 to 27 MHz crystal
MIN
397
TYP
f_XOSC/2¹⁶
±40
50-kHz offset from carrier
-95
100-kHz offset from carrier
-94
200-kHz offset from carrier
-94
RF carrier phase noise
500-kHz offset from carrier
1-MHz offset from carrier
-98
-107
2-MHz offset from carrier
-112
5-MHz offset from carrier
-118
PLL turn-on and hop time⁽⁴⁾
PLL RX to TX settling time⁽⁵⁾
PLL TX to RX settling time⁽⁶⁾
PLL calibration time⁽⁷⁾
10-MHz offset from carrier
Crystal oscillator running
-129
85.1
9.3
20.7
694
MAX
412
88.4
9.6
21.5
721
UNIT
Hz
ppm
dBc/Hz
µs
µs
µs
µs
(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
(2) The resolution (in Hz) is equal for all frequency bands.
(3) Depends on crystal used. Required accuracy (including temperature and aging) depends on frequency band and channel bandwidth /
spacing.
(4) Time from leaving the IDLE state until arriving in the RX, FSTXON, or TX state when not performing calibration.
(5) Settling time for the 1-IF frequency step from RX to TX
(6) Settling time for the 1-IF frequency step from TX to RX
(7) Calibration can be initiated manually or automatically before entering or after leaving RX/TX
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