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GC5316 Datasheet, PDF (71/75 Pages) Texas Instruments – HIGH-DENSITY DIGITAL DOWNCONVERTER AND UPCONVERTER
www.ti.com
GC5316
SLWS154A − JANUARY 2004 − REVISED MARCH 2004
7.4 Power Consumption
The maximum power consumption is a function of the operating mode of the chip. The cmd5316 estimates the typical
power supply current for the chip in a specific configuration. The AC Characteristics table provides maximum current
in a maximum configuration used in production test.
Current consumption on the pad supply is primarily due to the external loads and follows C x V x F. Internal loads
are estimated at 2 pF per pin. Data outputs have a transition density of going from a zero to a one, once per four
clocks, while clock outputs transition every cycle. The frame strobes consume negligible power due to the low
transition frequency. In general:
Ipad = Σ DataPad/4 x C x F x V + Σ ClockPad x C x F x V
A worst case current would be all transmit and receive ports operating at 125 MHz.
Ipad = (1+(4 x 18 + 4 x 2 x 6)/4) x (C + 2pF) x Fout x Vpad = 31 x 22 pF x 125 MHz x 3.3 V = 280 mA.
A more typical application with two ports active would use roughly 150 mA.
7.5 DC Operating Conditions (−40°C to 85°C case unless otherwise noted)
PARAMETER
VPAD = 3 V to 3.6 V
MIN
TYP
MAX
VIL Voltage input low (4)
0.8
VIH Voltage input high (4)
2
VOL Voltage output low (4) (IOL = 2 mA)
VOH Voltage output high (4) (IOH = −2 mA)
2.4
| IPU | Pullup current (VIN = 0 V) (tdi, tms, trst_n, reset_n) (nominal 20 µA) (4)
5
| IPD | Pulldown current (VIN = VPAD) (all other inputs and bidirs) (nominal 20 µA) (4)
5
Leakage (VIN = VPAD) (tdi, tms, trst_n, reset_n) (4)
| IIN | Leakage (VIN = 0) (all other inputs and bidirs) (4)
ICCQ
Leakage (VIN = 0 or VPAD) (all outputs) (4)
Quiescent supply current, ICORE (4)
CIN Capacitance for inputs (5)
0.5
VPAD
35
35
2
2
2
8
5
CBI Capacitance for bidirectionals (5)
5
NOTE: Voltages are measured at low speed. Output voltages are measured with the indicated current load.
NOTE: Currents are measured at nominal voltages, high temperature (100°C for production test, 85°C for QA).
(4) Each part is tested at 100°C case temperature for the given specification. Lots are sample tested at −40°C.
(5) Controlled by design and process and not directly tested.
UNITS
V
V
V
V
µA
µA
µA
mA
pF
pF
71