M36W832TE Datasheet, PDF (45/64 Pages) STMicroelectronics – 32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product

M36W832TE, M36W832BE
PART NUMBERING
Table 24. Ordering Information Scheme
Example:
M36 W 8 32T E
Device Type
M36 = MMP (Flash + SRAM)
Operating Voltage
W = V_DDF = 2.7V to 3.3V, V_DDS = V_DDQF = 2.7V to 3.3V
SRAM Chip Size & Organization
8 = 8 Mbit (512Kb x 16 bit)
Flash Chip Size & Organization
32T = 32 Mbit (x16), Boot Block, Top configuration
32B = 32 Mbit (x16), Boot Block, Bottom configuration
SRAM Component
E = 8Mb, 0.16µm, 70ns, 3.0V
Speed
70 = 70ns
85 = 85ns
Package
ZA = LFBGA66: 12x8mm, 0.8mm pitch
Temperature Range
1 = 0 to 70°C
6 = –40 to 85°C
Option
T = Tape & Reel packing
S = Special Tape
70 ZA 6 T
Devices are shipped from the factory with the memory content bits erased to ’1’.
Table 25. Daisy Chain Ordering Scheme
Example:
M36W832TE
-ZA T
Device Type
M36W832TE
Daisy Chain
-ZA = LFBGA66: 12x8mm, 0.8mm pitch
Option
T = Tape & Reel Packing
For a list of available options (Speed, Package, etc.) or for further information on any aspect of this device,
please contact the STMicroelectronics Sales Office nearest to you.
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