SI53320-28 Datasheet, PDF (44/51 Pages) Silicon Laboratories – Output Enable option

7.5 32-Pin eLQFP Land Pattern
Si53320-28 Data Sheet
Land Patterns
Figure 7.5. 32-Pin eLQFP Land Pattern
Table 7.5. 32-eLQFP Land Pattern Dimensions
Dimension
Min
Max
C1
8.40
8.50
C2
8.40
8.50
D1
1.84
2.00
D2
1.84
2.00
E
0.80 BSC
X1
0.40
0.50
Y1
1.25
1.35
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 mm
minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
4. A single 1.5 x 1.5 mm stencil aperture should be used for the center ground pad to achieve between 50-60% solder coverage.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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