SI53320-28 Datasheet, PDF (36/51 Pages) Silicon Laboratories – Output Enable option

6.2 20-Pin TSSOP Package
Si53320-28 Data Sheet
Package Outlines
Figure 6.2. 20-Pin TSSOP Package
Table 6.2. 20-TSSOP Package Dimensions
Dimension
Min
Nom
Max
Dimension
Min
Nom
Max
A
—
—
1.20
e
0.65 BSC
A1
0.05
—
0.15
L
0.45
0.60
0.75
A2
0.80
1.00
1.05
L2
0.25 BSC
b
0.19
—
0.30
q
0°
—
8°
c
0.09
—
0.20
aaa
0.10
D
6.40
6.50
6.60
bbb
0.10
E
6.40 BSC
ccc
0.20
E1
4.30
4.40
4.50
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-153, Variation AC.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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