SI53320-28 Datasheet, PDF (19/51 Pages) Silicon Laboratories – Output Enable option

Si53320-28 Data Sheet
Electrical Specifications
Table 3.8. Thermal Conditions
Parameter
16-QFN Thermal Resistance, Junction to Ambient
16-QFN Thermal Resistance, Junction to Case
20-TSSOP Thermal Resistance, Junction to Ambient
24-QFN Thermal Resistance, Junction to Ambient
24-QFN Thermal Resistance, Junction to Case
32-eLQFP Thermal Resistance, Junction to Ambient
32-eLQFP Thermal Resistance, Junction to Case
32-QFN Thermal Resistance, Junction to Ambient
32-QFN Thermal Resistance, Junction to Case
Symbol
θ_JA
θ_JC
θ_JA
θ_JA
θ_JC
θ_JA
θ_JC
θ_JA
θ_JC
Test Condition
Still air
Still air
Still air
Still air
Still air
Still air
Still air
Still air
Still air
Table 3.9. Absolute Maximum Ratings¹
Value
57.6
41.5
93.88
37
25
54.9
10.0
99.6
10.3
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Storage Temperature
T_S
–55
—
150
°C
Supply Voltage
V_DD
–0.5
—
3.8
V
Input Voltage
V_IN
–0.5
—
V_DD + 0.3
V
Output Voltage
V_OUT
—
—
V_DD + 0.3
V
ESD Sensitivity
HBM
CDM
HBM, 100 pF, 1.5 kΩ
—
—
2000
V
—
—
500
V
Peak Soldering Reflow
Temperature
T_PEAK
Pb-Free; Solder reflow profile
per JEDEC J-STD-020
—
—
260
°C
Maximum Junction
Temperature
T_J
—
—
125
°C
Note:
1. Stresses beyond those listed in this table may cause permanent damage to the device. Functional operation specification compli-
ance is not implied at these conditions. Exposure to maximum rating conditions for extended periods may affect device reliability.
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