EFM8SB1 Datasheet, PDF (38/55 Pages) Silicon Laboratories – The EFM8SB1 highlighted features are listed below

7.2 CSP16 PCB Land Pattern
EFM8SB1 Data Sheet
CSP16 Package Specifications
Figure 7.2. CSP16 PCB Land Pattern Drawing
Table 7.2. CSP16 PCB Land Pattern Dimensions
Dimension
Min
Max
X
0.20
C1
1.20
C2
1.20
E1
0.40
E2
0.40
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
6. The stencil thickness should be 0.075 mm (3 mils).
7. A stencil of square aperture (0.22 x 0.22 mm) is recommended.
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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