EFM8SB1 Datasheet, PDF (36/55 Pages) Silicon Laboratories – The EFM8SB1 highlighted features are listed below

7. CSP16 Package Specifications
EFM8SB1 Data Sheet
CSP16 Package Specifications
7.1 CSP16 Package Dimensions
Note: CSP devices can be handled and soldered using industry standard surface mount assembly techniques. However, because CSP
devices are essentially a piece of silicon and are not encapsulated in plastic, they are susceptible to mechanical damage and may be
sensitive to light. When CSP packages must be used in an environment exposed to light, it may be necessary to cover the top and
sides with an opaque material.
Figure 7.1. CSP16 Package Drawing
Dimension
A
A1
A2
b
S
D
E
e
D1
Table 7.1. CSP16 Package Dimensions
Min
0.491
0.17
0.036
0.23
0.3075
Typ
0.55
—
0.040
—
0.31
1.781 BSC
1.659 BSC
0.40 BSC
1.20 BSC
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Max
0.609
0.23
0.044
0.29
0.3125
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