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| EFM8SB1 Datasheet, PDF (37/55 Pages) Silicon Laboratories – The EFM8SB1 highlighted features are listed below | |||
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EFM8SB1 Data Sheet
CSP16 Package Specifications
Dimension
Min
Typ
Max
E1
1.20 BSC
SD
0.2
SE
0.2
n
16
aaa
0.03
bbb
0.06
ccc
0.05
ddd
0.015
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. Primary datum âCâ and seating plane are defined by the spherical crowns of the solder balls.
4. Dimension âbâ is measured at the maximum solder bump diameter, parallel to primary datum âCâ.
5. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.
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