EFM8SB1 Datasheet, PDF (34/55 Pages) Silicon Laboratories – The EFM8SB1 highlighted features are listed below

EFM8SB1 Data Sheet
Pin Definitions
6.4 EFM8SB1x-CSP16 Pin Definitions
CSP devices can be handled and soldered using industry standard surface mount assembly techniques. However, because CSP devi-
ces are essentially a piece of silicon and are not encapsulated in plastic, they are susceptible to mechanical damage and may be sensi-
tive to light. When CSP packages must be used in an environment exposed to light, it may be necessary to cover the top and sides with
an opaque material.
A1
P0.7
B1
P1.0
C1
P1.3
D1
P1.1
A2
P0.5
A3
P0.4
A4
P0.0
B2
P0.3
B3
P0.2
B4
GND
C2
P0.6
C3
P0.1
C4
VDD
D2
P1.4
D3
D4
RSTb / C2CK P2.7 / C2D
Pin
Number
A1
Pin Name
P0.7
A2
P0.5
A3
P0.4
16 pin CSP
(Top View)
Figure 6.4. EFM8SB1x-CSP16 Pinout
Table 6.4. Pin Definitions for EFM8SB1x-CSP16
Description
Multifunction I/O
Multifunction I/O
Multifunction I/O
Crossbar Capability
Yes
Yes
Yes
Additional Digital
Functions
P0MAT.7
INT0.7
INT1.7
P0MAT.5
INT0.5
INT1.5
P0MAT.4
INT0.4
INT1.4
Analog Functions
ADC0.7
CS0.7
IREF0
ADC0.5
CS0.5
ADC0.4
CS0.4
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