PD72042B_15 Datasheet, PDF (89/92 Pages) Renesas Technology Corp – LSI DEVICE FOR Inter Equipment BusTM (IEBusTM) PROTOCOL CONTROL

µPD72042B
9. RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Surface mount devices
µPD72042BGT: 16-pin plastic SOP (9.53 mm (375))
Process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Conditions
Peak temperature: 235 °C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 2 times.
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 2 times.
Solder temperature: 260 °C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (Per each side of the device).
Symbol
IR35-00-2
VP15-00-2
WS60-00-1
—
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or
the device will be damaged by heat stress.
Data Sheet S13990EJ3V0DS
87