PD77210_15 Datasheet, PDF (73/76 Pages) Renesas Technology Corp – 16-BIT FIXED-POINT DIGITAL SIGNAL PROCESSOR

12. RECOMMENDED SOLDERING CONDITIONS
µPD77210, 77213
The µPD77210 Family should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Surface Mounting Type Soldering Conditions
µPD77210F1-DA2:161-pin plastic fine pitch BGA (10 x 10)
µPD77213F1-xxx-DA2:161-pin plastic fine pitch BGA (10 x 10)
Soldering method
Soldering conditions
Infrared reflow
Package peak temperature: 235 °C, Time: 30 sec. Max. (at 210 °C or higher).
Count: two times or less
Exposure limit: 7 days ^Note (after that prebaking is necessary at 125 °C for 10 to 72
hours)
Recommended
condition symbol
IR35-107-2
µPD77210GJ-8EN:144-pin plastic LQFP (fine pitch) (20 x 20)
µPD77213GJ-xxx-8EN:144-pin plastic LQFP (fine pitch) (20 x 20)
Soldering method
Soldering conditions
Infrared reflow
Partial heating
Package peak temperature: 235 °C, Time: 30 sec. Max. (at 210 °C or higher).
Count: two times or less
Exposure limit: 3 days ^Note (after that prebaking is necessary at 125 °C for 10 to 72
hours)
Pin temperature: 300 °C Max. , Time: 3 sec. Max. (per pin row)
Recommended
condition symbol
IR35-103-2
−
Note After opening the dry pack, store it at 25 °C or less and 65 % RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for the partial heating).
Data Sheet U15203EJ3V0DS
71