PD70F3826_15 Datasheet, PDF (70/75 Pages) Renesas Technology Corp – RENESAS MCU

μ PD70F3826, 70F3827, 70F3828, 70F3829, 70F3830, 70F3831, 70F3832, 70F3833, 70F3834, 70F3835, 70F3836, 70F3837 31. PACKAGE DRAWINGS
31. PACKAGE DRAWINGS
• V850ES/JE3-E
64-PIN PLASTIC LQFP(FINE PITCH)(10x10)
HD
D
detail of lead end
48
49
33
32
A3
c
E HE
θ
L
Lp
L1
64
1
ZE
ZD
17
16
e
b
xM S
yS
NOTE
Each lead centerline is located within 0.08 mm of
its true position at maximum material condition.
(UNIT:mm)
ITEM DIMENSIONS
D
10.00±0.20
E
10.00±0.20
HD
12.00±0.20
HE
12.00±0.20
A
1.60 MAX.
A1
0.10±0.05
A2
1.40±0.05
A
A2
A3
0.25
b
0.20
+0.07
−0.03
c
0.125
+0.075
−0.025
L
0.50
Lp
0.60±0.15
L1
1.00±0.20
S
θ
3°
+5°
−3°
e
0.50
x
0.08
A1
y
0.08
ZD
1.25
ZE
1.25
P64GB-50-GAH
R01DS0029EJ0001 Rev.0.01
Sep 30, 2010
Page 70 of 75