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RX630_15 Datasheet, PDF (114/156 Pages) Renesas Technology Corp – Renesas MCUs
RX630 Group
5. Electrical Characteristics
SOSCCR.SOSTP
Sub-clock oscillator output
Sub-clock
tSUBOSC
tSUBOSCWT0
*1
Note 1: This is the waiting period obtained by setting the SOCCWTCR.SSTS[4:0] bits.
Figure 5.12 Sub-Clock Oscillation Start Timing
5.3.3
Timing of Recovery from Low Power Consumption Modes
Table 5.13 Timing of Recovery from Low Power Consumption Modes
Conditions: VCC = AVCC0 = VREFH = VCC_USB = VBATT = 2.7 to 3.6 V, VREFH0 = 2.7 V to AVCC0,
VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V, Ta = Topr
Item
Symbol Min.
Typ.
Max.
Unit
Test
Conditions
Recovery time Crystal resonator Main clock oscillator
after
connected to
operating
tSBYMC
10
—
—
ms Figure 5.13
cancellation of main clock
software
oscillator
standby mode
Main clock oscillator and
tSBYPC
10
—
PLL circuit operating
—
ms
External clock
input to main
Main clock oscillator
operating
tSBYEX
1
—
—
ms
clock oscillator
Main clock oscillator and
PLL circuit operating
tSBYPE
1
—
—
ms
Sub-clock oscillator operating
tSBYSC
2
—
—
s
High-speed on-chip oscillator operating
tSBYHO
—
—
2
ms
Low-speed on-chip oscillator or IWDT-dedicated tSBYLO
—
—
800
µs
on-chip oscillator operating
Recovery time after cancellation of deep software standby mode tDSBY
—
—
1.0
ms Figure 5.14
Wait time after cancellation of deep software standby mode
tDSBYWT 45
—
46
tcyc
Note:
The wait time varies depending on the state in which each oscillator was when the WAIT instruction was executed. The recovery
time when multiple oscillators are operating is the same period as that when the oscillator which requires the longest time of all
operating oscillators to recover is operating alone.
R01DS0060EJ0160 Rev.1.60
May 19, 2014
Page 114 of 154