RX220_15 Datasheet, PDF (1/107 Pages) Renesas Technology Corp – Renesas MCUs

Datasheet
RX220 Group
Renesas MCUs
32-MHz 32-bit RX MCUs, 49 DMIPS, up to 256-KB flash memory,
12-bit A/D, ELC, MPC, IrDA, RTC, up to 7 comms channels;
incorporating functions for IEC60730 compliance
R01DS0130EJ0110
Rev.1.10
Dec 20, 2013
Features
■ 32-bit RX CPU core
 Max. operating frequency: 32 MHz
 Capable of 49 DMIPS in operation at 32 MHz
 Accumulator handles 64-bit results (for a single
instruction) from 32- × 32-bit operations
 Multiplication and division unit handles 32- × 32-bit
operations (multiplication instructions take one CPU
clock cycle)
 Fast interrupt
 CISC Harvard architecture with 5-stage pipeline
 Variable-length instructions, ultra-compact code
 On-chip debugging circuit
■ Low-power design and architecture
 Operation from a single 1.62-V to 5.5-V supply
 1.62-V operation available (at up to 8 MHz)
 Three low-power modes
■ On-chip flash memory for code, no wait states
 32-MHz operation, 31.25-ns read cycle
 No wait states for reading at full CPU speed
 Up to 256-Kbyte capacity
 User code programmable via the SCI
 Programmable at 1.62 V
 For instructions and operands
■ On-chip data flash memory
 8 Kbytes (Number of times of reprogramming: 100,000)
 Erasing and programming impose no load on the CPU.
■ On-chip SRAM, no wait states
 Up to 16-Kbyte size capacity
■ DMA
 DMAC: Incorporates four channels
 DTC: Four transfer modes
■ ELC
 Module operation can be initiated by event signals
without going through interrupts.
 Modules can operate while the CPU is sleeping.
■ Reset and supply management
 Seven types of reset, including the power-on reset (POR)
 Low voltage detection (LVD) with voltage settings
■ Clock functions
 Frequency of external clock: Up to 20 MHz
 Frequency of the oscillator for sub-clock generation:
32.768 kHz
 On-chip low- and high-speed oscillators, dedicated on-
chip low-speed oscillator for the IWDT
 Generation of a dedicated 32.768-kHz clock for the RTC
 Clock frequency accuracy measurement circuit (CAC)
■ Real-time clock
 Adjustment functions (30 seconds, leap year, and error)
 Year and month display or 32-bit second display (binary
counter) is selectable
R01DS0130EJ0110 Rev.1.10
Dec 20, 2013
PLQP0100KB-A 14 × 14 mm, 0.5-mm pitch
PLQP0064KB-A 10 × 10 mm, 0.5-mm pitch
PLQP0048KB-A 7 × 7 mm, 0.5-mm pitch
PLQP0064GA-A 14 × 14 mm, 0.8-mm pitch
■ Independent watchdog timer
 125-kHz on-chip oscillator produces a dedicated clock
signal to drive IWDT operation.
■ Useful functions for IEC60730 compliance
 Self-diagnostic and disconnection-detection assistance
functions for the A/D converter, clock-frequency
accuracy-measurement circuit, independent watchdog
timer, functions to assist in RAM testing, etc.
■ Up to seven communications channels
 SCI with many useful functions (up to five channels)
Asynchronous mode, clock synchronous mode, smart
card interface mode
 IrDA Interface (one channel, in cooperation with the
SCI5)
 I²C bus interface: Transfer at up to 400 kbps, capable of
SMBus operation (one channel)
 RSPI (one channel)
■ Up to 14 extended-function timers
 16-bit MTU: input capture, output capture,
complementary PWM output, phase counting mode
(six channels)
 8-bit TMR (four channels)
 16-bit compare-match timers (four channels)
■ 12-bit A/D converter
 Capable of conversion within 1.56 μs
 Self-diagnostic function and analog input disconnection
detection assistance function
■ Analog comparator
■ General I/O ports
 5-V tolerant, open drain, input pull-up, switching of
driving ability
■ MPC
 Multiple locations are selectable for I/O pins of
peripheral functions
■ Operating temp. range
 40C to +85C
 40C to +105C
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