CLRC632 Datasheet, PDF (160/163 Pages) NXP Semiconductors – Multiple Protocol Contactless Reader IC

Philips Semiconductors
Multiple Protocol Contactless Reader IC
25 PACKAGE OUTLINES
25.1 SO32
Product Specification Rev. 3.0; May 2003
CL RC632
SO32: plastic small outline package; 32 leads; body width 7.5 mm
SOT287-1
D
y
Z
32
pin 1 index
1
e
E
A
X
c
H_E
vM A
17
A₂
A₁
16
wM
b_p
Q
(A₃ ) ^A
θ
L_p
L
detail X
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT _max.
A₁
A₂
A₃
b_p
c
D⁽¹⁾ E⁽¹⁾ e
H_E
L
L_p Q
v
w
y Z⁽¹⁾ θ
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.27
0.18
20.7
20.3
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.2
1.0
0.25 0.25 0.1
0.95
0.55
8^o
inches
0.10
0.012 0.096
0.004 0.086
0.01
0.02 0.011 0.81
0.01 0.007 0.80
0.30
0.29
0.050
0.419
0.394
0.055
0.043
0.016
0.047
0.039
0.01
0.01
0.004
0.037
0.022
0^o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT287-1
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-25
97-05-22
Figure 255-1: Outline and Dimension of CL RC632 in SO32
160
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