MC9S08GB60 Datasheet, PDF (285/290 Pages) Motorola, Inc – Microcontrollers

B.6 42-Pin SDIP Package Drawing
-A-
42
1
-T-
SEATING
PLANE
F
G
D 42 PL
0.25 (0.010) M T A S
22
-B-
21
C
L
H
N
K
M
J 42 PL
0.25 (0.010) ^M T B ^S
42-Pin SDIP Package Drawing
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED
PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
MAXIMUM MOLD FLASH 0.25 (0.010).
INCHES
DIM MIN MAX
A 1.435 1.465
B 0.540 0.560
C 0.155 0.200
D 0.014 0.022
F 0.032 0.046
G 0.070 BSC
H 0.300 BSC
J 0.008 0.015
K 0.115 0.135
L 0.600 BSC
M
0
15
N 0.020 0.040
MILLIMETERS
MIN MAX
36.45 37.21
13.72 14.22
3.94 5.08
0.36 0.56
0.81 1.17
1.778 BSC
7.62 BSC
0.20 0.38
2.92 3.43
15.24 BSC
0
15
0.51 1.02
CASE 858-01
ISSUE O
DATE 02/27/90
MC9S08GB/GT Data Sheet, Rev. 2.3
Freescale Semiconductor
285