MC68HC08JK1 Datasheet, PDF (193/198 Pages) Motorola, Inc – HCMOS Microcontroller Unit

Freescale Semiconductor, Inc.
Technical Data — MC68H(R)C08JL3
Section 19. Mechanical Specifications
19.1 Contents
19.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
19.3 20-Pin PDIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
19.4 20-Pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
19.5 28-Pin PDIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
19.6 28-Pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
19.2 Introduction
This section gives the dimensions for:
• 20-pin plastic dual in-line package (case #738)
• 20-pin small outline integrated circuit package (case #751D)
• 28-pin plastic dual in-line package (case #710)
• 28-pin small outline integrated circuit package (case #751F)
The following figures show the latest package drawings at the time of
this publication. To make sure that you have the latest package
specifications, contact one of the following:
• Local Motorola Sales Office
• Motorola Mfax
– Phone [phone]
– EMAIL [e-mail]
• Worldwide Web (wwweb) at http://motorola.com/sps
Follow Mfax or Worldwide Web on-line instructions to retrieve the current
mechanical specifications.
MC68H(R)C08JL3 — Rev. 4
MOTOROLA
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
Technical Data
193