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MT40A256M16GE-075EAIT Datasheet, PDF (305/359 Pages) Micron Technology – Automotive DDR4 SDRAM | |||
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4Gb: x8, x16 Automotive DDR4 SDRAM
Current Specifications â Measurement Conditions
Figure 238: Thermal Measurement Point
(L/2)
TC test point
L
(W/2)
W
Current Specifications â Measurement Conditions
IDD, IPP, and IDDQ Measurement Conditions
IDD, IPP, and IDDQ measurement conditions, such as test load and patterns, are defined
in this section.
⢠IDD currents (IDD0, IDD1, IDD2N, IDD2NT, IDD2P, IDD2Q, IDD3N, IDD3P, IDD4R, IDD4W, IDD5R,
IDD6N, IDD6E, IDD6R, IDD7, and IDD8) are measured as time-averaged currents with all
VDD balls of the device under test grouped together. IPP and IDDQ currents are not in-
cluded in IDD currents.
⢠IPP currents are IPPSB for standby cases (IDD2N, IDD2NT, IDD2P, IDD2Q, IDD3N, IDD3P, IDD8);
IPP0 for active cases (IDD0,IDD1, IDD4R, IDD4W); IPP5R and IPP6N for self refresh cases
(IDD6N, IDD6E, IDD6R), and IPP7. These have the same definitions as the IDD currents ref-
erenced but are measured on the VPP supply.
⢠IDDQ currents (IDDQ2NT and IDDQ4R) are measured as time-averaged currents with
VDDQ balls of the device under test grouped together. IDD current is not included in
IDDQ currents.
Note: IDDQ values cannot be directly used to calculate the I/O power of the de-
vice. They can be used to support correlation of simulated I/O power to actual
I/O power. In DRAM module application, IDDQ cannot be measured separately
because VDD and VDDQ are using a merged-power layer in the module PCB.
The following definitions apply for IDD, IDDP and IDDQ measurements.
⢠â0â and âLOWâ are defined as VIN ÂVIL(AC)max
⢠â1â and âHIGHâ are defined as VIN ÂVIH(AC)min
⢠âMidlevelâ is defined as inputs VREF = VDD/2
⢠Timings used for IDD, IDDP and IDDQ measurement-loop patterns are provided in the
Current Test Definition and Patterns section.
⢠Basic IDD, IPP, and IDDQ measurement conditions are described in the Current Test
Definition and Patterns section.
CCMTD-1725822587-10418
4gb_auto_ddr4_sdram_z90b.pdf - Rev. D 01/17 EN
305
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2016 Micron Technology, Inc. All rights reserved.
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