MT40A256M16GE-075EAIT Datasheet, PDF (255/359 Pages) Micron Technology – Automotive DDR4 SDRAM

4Gb: x8, x16 Automotive DDR4 SDRAM
Electrical Specifications
Electrical Specifications
Absolute Ratings
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at these or any other condi-
tions outside those indicated in the operational sections of this specification is not im-
plied. Exposure to absolute maximum rating conditions for extended periods may ad-
versely affect reliability. Although "unlimited" row accesses to the same row is allowed
within the refresh period; excessive row accesses to the same row over a long term can
result in degraded operation.
Table 76: Absolute Maximum Ratings
Symbol
V_DD
V_DDQ
V_PP
V_IN, V_OUT
T_STG
Parameter
Voltage on V_DD pin relative to V_SS
Voltage on V_DDQ pin relative to V_SS
Voltage on V_PP pin relative to V_SS
Voltage on any pin relative to V_SS
Storage temperature
Min
–0.4
–0.4
–0.4
–0.4
–55
Max
1.5
1.5
3.0
1.5
150
Unit
V
V
V
V
°C
Notes
1
1
3
2
Notes:
1. V_DD and V_DDQ must be within 300mV of each other at all times, and V_REF must not be
greater than 0.6 × V_DDQ. When V_DD and V_DDQ are <500mV, V_REF can be ≤300mV.
2. Storage temperature is the case surface temperature on the center/top side of the
DRAM. For the measurement conditions, please refer to the JESD51-2 standard.
3. V_PP must be equal to or greater than V_DD/V_DDQ at all times when powered.
DRAM Component Operating Temperature Range
Operating temperature, T_OPER, is the case surface temperature on the center/top side of
the DRAM. For measurement conditions, refer to the JEDEC document JESD51-2.
Table 77: Temperature Range
Symbol
T_OPER
Parameter
Normal operating temperature range
Extended temperature range (optional)
Min
–40
>85
Max
85
125
Unit
°C
°C
Notes
1
2
Notes:
1. The normal temperature range specifies the temperatures at which all DRAM specifica-
tions will be supported. During operation, the DRAM case temperature must be main-
tained between –40°C to 85°C under all operating conditions for the commercial offer-
ing.
2. Some applications require operation of the commercial and industrial temperature
DRAMs in the extended temperature range (between 85°C and 125°C case tempera-
ture). Full specifications are supported in this range, but the following additional condi-
tions apply:
• REFRESH commands must be doubled in frequency, reducing the refresh interval ^tREFI
to 3.9μs. It is also possible to specify a component with 1X refresh (^tREFI to 7.8μs) in
the extended temperature range.
CCMTD-1725822587-10418
4gb_auto_ddr4_sdram_z90b.pdf - Rev. D 01/17 EN
255
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2016 Micron Technology, Inc. All rights reserved.