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PIC18LF2X_13 Datasheet, PDF (559/560 Pages) Microchip Technology – PIC18(L)F2X/45K50 USB Flash MCU Product Brief
PIC18(L)F2X/4XK22
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
[X](2)
-
X
Tape and Reel Temperature
Option
Range
/XX
Package
XXX
Pattern
Device:
PIC18F46K22, PIC18LF46K22
PIC18F45K22, PIC18LF45K22
PIC18F44K22, PIC18LF44K22
PIC18F43K22, PIC18LF43K22
PIC18F26K22, PIC18LF26K22
PIC18F25K22, PIC18LF25K22
PIC18F24K22, PIC18LF24K22
PIC18F23K22, PIC18LF23K22
Examples:
a) PIC18(L)F45K22-E/P 301 = Extended temp.,
PDIP package, QTP pattern #301.
b) PIC18F46K22-I/SO = Industrial temp., SOIC
package.
c) PIC18F46K22-E/P = Extended temp., PDIP
package.
d) PIC18F46K22T-I/ML = Tape and reel, Industrial
temp., QFN package.
Tape and Reel
Option:
Temperature
Range:
Package:
Blank = standard packaging (tube or tray)
T = Tape and Reel(1), (2)
E
= -40C to +125C (Extended)
I
= -40C to +85C (Industrial)
ML = QFN
MV = UQFN
P = PDIP
PT = TQFP (Thin Quad Flatpack)
SO = SOIC
SP = Skinny Plastic DIP
SS = SSOP
Note 1:
2:
Tape and Reel option is available for ML,
MV, PT, SO and SS packages with industrial
Temperature Range only.
Tape and Reel identifier only appears in
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package.
Pattern:
QTP, SQTP, Code or Special Requirements
(blank otherwise)
 2010-2012 Microchip Technology Inc.
DS41412F-page 559