PIC18F2455_07 Datasheet, PDF (408/430 Pages) Microchip Technology – 28/40/44-Pin, High Performance, Enhanced Flash, USB Microcontrollers with nanoWatt Technology

PIC18F2455/2550/4455/4550
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
E
e
E1
N
b
NOTE 1
1 23
NOTE 2
A
α
c
φ
β
A1
A2
L
L1
Units
Dimension Limits
MILLIMETERS
MIN
NOM
MAX
Number of Leads
Lead Pitch
Overall Height
N
44
e
0.80 BSC
A
–
–
1.20
Molded Package Thickness
Standoff
Foot Length
A2
0.95
A1
0.05
L
0.45
1.00
–
0.60
1.05
0.15
0.75
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
L1
1.00 REF
φ
0°
3.5°
7°
E
12.00 BSC
D
12.00 BSC
E1
10.00 BSC
D1
10.00 BSC
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.30
0.37
0.45
Mold Draft Angle Top
α
11°
12°
13°
Notes:
Mold Draft Angle Bottom
β
11°
12°
13°
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-076B
DS39632D-page 406
Preliminary
© 2007 Microchip Technology Inc.