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PIC18LF2XK22 Datasheet, PDF (39/42 Pages) Microchip Technology – Flash Memory Programming Specification | |||
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PIC18(L)F2XK22/4XK22
Standard Operating Conditions
Operating Temperature: 25ï°C is recommended
Param
No.
Sym.
Characteristic
Min.
Max. Units
Conditions
P14 TVALID Data Out Valid from PGC ï
10
â
ns
P15 THLD4 Input data hold time from MCLR ï
400
â
ïs
P16 TDLY8 Delay between Last PGC ï¯ and MCLR/VPP/RE3 ï¯
0
â
s
P17 THLD3 MCLR/VPP/RE3 ï¯ï to VDD ï¯
â
100 ns
P18 TKEY1 Delay from First MCLR ï¯ï to first PGC ïï for Key Sequence
1
on PGD
â ms
P19 THIZ Delay from PGC ïï to PGD High-Z
3
10
ns
P20 TKEY2 Delay from Last PGC ï¯ï for Key Sequence on PGD to
Second MCLR ï
40
â
ns
Note 1:
Do not allow excess time when transitioning MCLR between VIL and VIHH; this can cause spurious program executions
to occur. The maximum transition time is:
1 TCY + TPWRT (if enabled) + 1024 TOSC (for LP, HS, HS/PLL and XT modes only) + 2 ms (for HS/PLL mode only) + 1.5
ïs (for EC mode only) where TCY is the instruction cycle time, TPWRT is the Power-up Timer period and TOSC is the
oscillator period. For specific values, refer to the Electrical Characteristics section of the device data sheet for the
particular device.
ï£ 2010 Microchip Technology Inc.
Advance Information
DS41398B-page 39
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