ISL6323B Datasheet, PDF (33/35 Pages) Intersil Corporation – Monolithic Dual PWM Hybrid Controller Powering AMD SVI Split-Plane and PVI Uniplane Processors

ISL6323B
significantly reduce the possibility of shoot-through. It is also
important to route each channels UGATE and PHASE traces
in as close proximity as possible to reduce their inductances.
Current Sense Component Placement and
Trace Routing
One of the most critical aspects of the ISL6323B regulator
layout is the placement of the inductor DCR current sense
components and traces. The R-C current sense components
must be placed as close to their respective ISEN+ and
ISEN- pins on the ISL6323B as possible.
The sense traces that connect the R-C sense components to
each side of the output inductors should be routed on the
bottom of the board, away from the noisy switching
components located on the top of the board. These traces
should be routed side by side, and they should be very thin
traces. It’s important to route these traces as far away from
any other noisy traces or planes as possible. These traces
should pick up as little noise as possible.
Thermal Management
For maximum thermal performance in high current, high
switching frequency applications, connecting the thermal
GND pad of the ISL6323B to the ground plane with multiple
vias is recommended. This heat spreading allows the part to
achieve its full thermal potential. It is also recommended
that the controller be placed in a direct path of airflow if
possible to help thermally manage the part.
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FN6879.0
March 23, 2009