MC9328MXL Datasheet, PDF (82/84 Pages) Freescale Semiconductor, Inc – i.MX Integrated Portable System Processor

Pin-Out and Package Information
4.2 PBGA 225 Package Dimensions
Figure 64 illustrates the 225 PBGA 13 mm × 13 mm × 0.8 mm package.
Case Outline 1304B
TOP VIEW
BOTTOM VIEW
SIDE VIEW
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONS AND TOLERANCES PER ASME Y14 5M-1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE IS DEFINED BY SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
Figure 64. MC9328MXL 225 PBGA Mechanical Drawing
MC9328MXL Advance Information, Rev. 5
82
Freescale Semiconductor