908E621_12 Datasheet, PDF (7/60 Pages) Freescale Semiconductor, Inc – Integrated Quad Half bridge and Triple High Side Embedded MCU and LIN for High End Mirror

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground, unless otherwise noted. Exceeding limits on any pin may cause permanent damage
to the device.
Rating
Symbol
Value
Unit
THERMAL RATINGS
Operating Ambient Temperature⁽³⁾
Operating Junction Temperature⁽⁴⁾
Storage Temperature
Peak Package Reflow Temperature During Reflow^{(5), (6)}
T_A
T_J
T_STG
T_PPRT
-40 to 85
°C
-40 to 125
°C
-40 to 150
°C
Note 6
°C
Notes
3. The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking.
4. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150 °C under these conditions.
5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
6. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E621
7