908E621_12 Datasheet, PDF (58/60 Pages) Freescale Semiconductor, Inc – Integrated Quad Half bridge and Triple High Side Embedded MCU and LIN for High End Mirror

ADDITIONAL INFORMATION
THERMAL ADDENDUM (REV 1.0)
60
50
40
30
20
x R_θJA11
10
R_θJA22
R_θJA12 = R_θJA21
0
0
300
600
Heat spreading area A [mm²]
Figure 36. Device on Thermal Test Board R_θJA
100
10
1
0.1
1.00E-03
1.00E-02
x R_θJA11
R_θJA22
R_θJA12 = R_θJA21
1.00E-01 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04
T ime [s]
Figure 37. Transient Thermal Resistance R_θJA (1.0 W Step Response)
Device on Thermal Test Board Area A = 600 (mm²)
908E621
58
Analog Integrated Circuit Device Data
Freescale Semiconductor