MC33780 Datasheet, PDF (4/37 Pages) Freescale Semiconductor, Inc – Dual DBUS Master with Differential Drive and Frequency Spreading

MAXIMUM RATINGS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltages
V_SUP
Load Dump V_SUP (300 ms maximum)
V_CC
Maximum Voltage on Logic Input/Output Terminals
Maximum Voltage on DBUS Terminals
Maximum DBUS Terminal Current
Maximum Logic Terminal Current
ESD Voltage ⁽¹⁾
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
THERMAL RATINGS
V
V_SUP
V_SUPLD
V_CC
-0.3 to 26.5
40
-0.3 to 7.0
–
-0.3 to V_CC + 0.3
V
V_DBUS
-0.3 to V_SUP + 0.3
V
I_DBUS
400
mA
I_LOGIC
20
mA
V
V_ESD
±2000
±200
±750 for corner pins
±500 for others
Storage Temperature
T_stg
-55 to 150
°C
Operating Ambient Temperature
T_A
-40 to 85
°C
Operating Junction Temperature
T_J
-40 to 150
°C
Thermal Shutdown
T_SD
155 to 190
°C
Resistance, Junction-to-Ambient
R_θJA
109
°C/W
Resistance, Junction-to-Board
R_θJB
50
°C/W
Soldering Reflow Temperature
T_SOLDER
260
°C
Notes
1. ESD1 testing is performed in accordance with the Human Body Model (HBM) (C_ZAP = 100 pF, R_ZAP = 1500 Ω); ESD2 testing is
performed in accordance with the Machine Model (MM) (C_ZAP = 200 pF, R_ZAP = 0 Ω); and Charge Body Model (CBM).
33780
4
Analog Integrated Circuit Device Data
Freescale Semiconductor