MC9S12E64CPVE Datasheet, PDF (111/156 Pages) Freescale Semiconductor, Inc – MC9S12E-Family Device User Guide

Freescale Semicon_Dd_evu_icc_et_Uo_ser_r,_GI_un_idc_e._{— 9S12E128DGV1/D V01.04}
Table A-5 Thermal Package Characteristics¹
Num C
Rating
Symbol Min
Typ
1
T _{Thermal Resistance LQFP112, single sided PCB}²
θ_JA
–
–
Thermal Resistance LQFP112, double sided PCB
2
T _{with 2 internal planes3}
θ_JA
–
–
3
T Junction to Board LQFP112
θ_JB
–
–
4
T Junction to Case LQFP112
θ_JC
–
–
5
T Junction to Package Top LQFP112
Ψ_JT
–
–
6
T Thermal Resistance QFP 80, single sided PCB
θ_JA
–
–
7
T
Thermal Resistance QFP 80, double sided PCB with
2 internal planes
θ_JA
–
–
8
T Junction to Board QFP80
θ_JB
–
–
9
T Junction to Case QFP80
θ_JC
–
–
10
T Junction to Package Top QFP80
Ψ_JT
–
–
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-3
3. PC Board according to EIA/JEDEC Standard 51-7
Max
54
Unit
°^oC/W
41
o_C/W
31
°^oC/W
11
o_C/W
2
o_C/W
51
°^oC/W
41
o_C/W
27
°^oC/W
14
o_C/W
3
o_C/W
A.1.9 I/O Characteristics
This section describes the characteristics of all 3.3V/5V I/O pins. All parameters are not always applicable,
e.g. not all pins feature pull up/down resistances.
111
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