BCM43143KMLGT Datasheet, PDF (55/58 Pages) Cypress Semiconductor – Single-Chip IEEE 802.11b/g/n MAC/PHY/Radio with USB/SDIO Host Interface

BCM43143 Advance Data Sheet
Thermal Information
Section 14: Thermal Information
Table 24: 56-pin QFN Thermal Characteristics^a
Air Velocity m/s Power W
T_{J_MAX} °C
T_t °C
JA, °C/W
0
1.166
110.3
105.2
37.95
a. 1s1P JEDEC board, package only, no heat sink, TA = 65°C. P = 1.061W (PA on).
_JT °C/W
4.37
Note:
• Ambient air temperature is 1 mm above the heat shield on top of the chip.
• Ambient air temperature: TA = 65°C, subject to absolute junction maximum temperature at
125°C.
• The BCM43143 is designed and rated for operation at a maximum junction temperature not to
exceed 125°C.
Junction Temperature Estimation and PSI_JT Versus Theta_JC
Package thermal characterization parameter Psi-J_T (_JT) yields a better estimation of actual junction
temperature (T_J) versus using the junction-to-case thermal resistance parameter Theta-J_C (_JC). The reason for
this is _JC assumes that all the power is dissipated through the top surface of the package case. In actual
applications, some of the power is dissipated through the bottom and sides of the package. _JT takes into
account power dissipated through the top, bottom, and sides of the package. The equation for calculating the
device junction temperature is as follows:
T_J = T_T + P _JT
Where:
• T_J = junction temperature at steady-state condition, °C
• T_T = package case top center temperature at steady-state condition, °C
• P = device power dissipation, Watts
• _JT = package thermal characteristics (no airflow), °C/W
Broadcom^®
November 14, 2014 • 43143-DS104-R
Single-Chip IEEE 802.11b/g/n MAC/PHY/Radio
Page 54