405EX Datasheet, PDF (46/67 Pages) Applied Micro Circuits Corporation – PowerPC 405EX Embedded Processor

PPC405EX – PowerPC 405EX Embedded Processor
Thermal Management
Revision 1.09 - August 21, 2007
Preliminary Data Sheet
Table 8. Package Thermal Specifications
The PPC405EX is designed to operate within a case temperature range T_C defined in “Recommended DC Operating
Conditions” on page 47. Thermal resistance values for the EPBGA packages in a convection environment are as follows:
Parameter
Symbol
0 (0)
100 (0.51)
Airflow
ft/min (m/sec)
200 (1.02) 300 (1.52) 400 (2.02)
500 (2.53)
600 (3.03)
Junction-to-ambient
thermal resistance
without heat sink
θ_JA
18.9
16.6
15.8
15.4
15.0
14.7
14.4
Junction-to-ambient
thermal resistance
with heat sink
θ_JA
15.5
12.5
11.4
10.9
10.7
10.5
10.3
Resistance Value
Junction-to-case thermal
resistance
θ_JC
8.96
Junction-to-board thermal
resistance
θ_JB
13.74
Notes:
1. Values in the table are achieved with the following JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, T_C, is measured at top center of case surface with device soldered to circuit board.
b. T_A = T_C – Pxθ_CA, where T_A is ambient temperature and P is power consumption.
c. T_CMax = T_JMax – Pxθ_JC, where T_JMax is maximum junction temperature and P is power consumption.
Unit
°C/W
°C/W
°C/W
°C/W
The following heat sink was used in the above thermal analysis:
26.92mm x 27mm x 11.43mm
The heat sink is manufactured by:
Aavid Thermalloy, P/N 62925
46
AMCC Proprietary