W632GG8KB Datasheet, PDF (158/159 Pages) Winbond – 32M X 8 BANKS X 8 BIT DDR3 SDRAM

W632GG8KB
11. PACKAGE SPECIFICATION
Package Outline WBGA78 (8x10.5 mm², Ball pitch: 0.8mm, Ø =0.45mm)
eD
D1
E1
eE
9 8 76 5 43 2 1
A1
Pin A1 index
// ^{bbb C}
A
A
B
C
D
E
F
G
H
J
K
L
M
N
E
Pin A1 index
aaa C 4X
B
A
D
78xΦb
SOLDER BALL DIAMETER REFERS.
TO POST REFLOW CONDITION.
ddd M C A B
eee M C
THE WINDOW-SIDE
ENCAPSULANT
SYMBOL
A
A1
b
D
E
D1
E1
eE
eD
aaa
bbb
ccc
ddd
eee
Dimension in mm
MIN. NOM. MAX.
---
---
1.20
0.25
---
0.40
0.40 0.45 0.50
10.40 10.50 10.60
7.90 8.00 8.10
9.60 BSC.
6.40 BSC.
0.80 BSC.
0.80 BSC.
---
---
0.15
---
---
0.20
---
---
0.10
---
---
0.15
---
---
0.08
Dimension in inch
MIN. NOM. MAX.
---
--- 0.0472
0.0098 --- 0.0157
0.0157 --- 0.0197
0.4094 0.4134 0.4173
0.3110 0.3150 0.3189
0.3780 BSC.
0.2519 BSC.
0.0315 BSC.
0.0315 BSC.
---
--- 0.0059
---
--- 0.0780
---
--- 0.0039
---
--- 0.0059
---
--- 0.0031
ccc C
C
Ball Land
1
Ball Opening
Note:
1. Ball land: 0.5mm, Ball opening: 0.4mm, PCB Ball land
suggested ≤ 0.4mm
- 158 -
Publication Release Date: Dec. 08, 2014
Revision: A04