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W632GG8KB Datasheet, PDF (10/159 Pages) Winbond – 32M X 8 BANKS X 8 BIT DDR3 SDRAM
W632GG8KB
B3, C7,C2, C8, E3,
E8, D2, E7
DQ0−DQ7
Input/Output Data Input/Output: Bi-directional data bus.
C3, D3
DQS, DQS#
Input/Output
Data Strobe: Output with read data, input with write data. Edge-
aligned with read data, centered in write data. DQS is paired with
DQS# to provide differential pair signaling to the system during read
and write data transfer. DDR3 SDRAM supports differential data
strobe only and does not support single-ended.
B7, A7
TDQS, TDQS#
Output
Termination Data Strobe: When TDQS enabled via Mode Register
A11 = 1 in MR1, the DRAM will enable the same termination
resistance function on TDQS/TDQS# that is applied to DQS/DQS#.
When TDQS disabled via mode register A11 = 0 in MR1, DM/TDQS
will provide the data mask function and TDQS# is not used.
A2, A9, D7, G2, G8,
K1, K9, M1, M9
VDD
Supply
Power Supply: 1.5V ± 0.075V.
A1, A8, B1, D8, F2,
F8, J1, J9, L1, L9,
VSS
N1, N9
Supply
Ground.
B9, C1, E2, E9
VDDQ
Supply
DQ Power Supply: 1.5V ± 0.075V.
B2, B8, C9, D1, D9
VSSQ
Supply
DQ Ground.
E1
VREFDQ
Supply
Reference voltage for DQ.
J8
VREFCA
Supply
Reference voltage for Control, Command and Address inputs.
External reference ball for output drive and On-Die Termination
H8
ZQ
Supply
Impedance calibration: This ball needs an external 240Ω ± 1%
external resistor (RZQ), connected from this ball to ground to perform
ZQ calibration.
A3, F1, F9, H1, H9,
J7
NC
No Connect: No internal electrical connection is present.
Note:
Input only balls (BA0-BA2, A0-A14, RAS#, CAS#, WE#, CS#, CKE, ODT and RESET#) do not supply termination.
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Publication Release Date: Jul. 28, 2014
Revision: A04