W83637HF Datasheet, PDF (143/149 Pages) Winbond – LPC I/O

W83637HF
12. PACKAGE DIMENSIONS
(128-pin QFP)
102
103
HE
E
65
64
D HD
128
1
e
b
See Detail F
Seating Plane
39
38
A
A2
A1
y
c
L
L1
Detail F
Symbol
A1
A2
b
c
D
E
e
HD
HE
L
L1
y
0
Min
0.25
2.57
0.10
0.10
13.90
19.90
17.00
23.00
0.65
0
Dimension in mm
Nom
Max
0.35
0.45
2.72
2.87
0.20
0.30
0.15
0.20
14.00
14.10
20.00
20.10
0.50
17.20
23.20
0.80
17.40
23.40
0.95
1.60
0.08
7
Dimension in inch
Min Nom Max
0.010 0.014 0.018
0.101 0.107 0.113
0.004 0.008 0.012
0.004 0.006 0.008
0.547 0.551 0.555
0.783 0.787 0.791
0.020
0.669 0.677 0.685
0.905 0.913 0.921
0.025 0.031 0.037
0.063
0.003
0
7
Note:
1.Dimension D & E do not include interlead
flash.
2.Dimension b does not include dambar
protrusion/intrusion .
3.Controlling dimension : Millimeter
4.General appearance spec. should be based
on final visual inspection spec.
5. PCB layout please use the "mm".
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
http://www.winbond.com.tw/
Taipei Office
9F, No.480, Rueiguang Rd.,
Neihu District, Taipei, 114,
Taiwan, R.O.C.
TEL: [phone]
FAX: [phone]
Winbond Electronics Corporation America
2727 North First Street, San Jose,
CA 95134, U.S.A.
TEL: [phone]
FAX: [phone]
Winbond Electronics (Shanghai) Ltd.
27F, 2299 Yan An W. Rd. Shanghai,
200336 China
TEL: [phone]
FAX: [phone]
Winbond Electronics Corporation Japan
7F Daini-ueno BLDG, 3-7-18
Shinyokohama Kohoku-ku,
Yokohama, 222-0033
TEL: [phone]
FAX: [phone]
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City,
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
Please note that all data and specifications are subject to change without notice.
All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
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Publication Release Date: June 25, 2003
Revision 1.3