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W3H32M72E-XSBX Datasheet, PDF (29/30 Pages) White Electronic Designs Corporation – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package | |||
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White Electronic Designs
ORDERING INFORMATION
W3H32M72E-XSBX
PRELIMINARY*
W 3H 32M 72 E - XXX SB X
WHITE ELECTRONIC DESIGNS CORP.
DDR2 SDRAM
CONFIGURATION, 32M x 72
1.8V Power Supply
DATA RATE (Mbs)
400 = 400Mbs CL3
533 = 533Mbs CL4
667 = 667Mbs(2) CL5
Blank = No data rate speciï¬ed for ES product(1)
PACKAGE:
ES = Non Qualiï¬ed Product (1)
SB = 208 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial -40°C to +85°C
C = Commercial 0°C to +70°C
Blank = No temperature speciï¬ed for ES product(1)
Note 1: W3H32M72E-ESSB is the only available product until completion of qualiï¬cation.
2: Data rate of 667Mbs is advanced, contact factory for future availability.
White Electronic Designs Corp. reserves the right to change products or speciï¬cations without notice.
February 2006
Rev. 2
29
White Electronic Designs Corporation ⢠(602) 437-1520 ⢠www.wedc.com
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