DRV2604L Datasheet, PDF (65/73 Pages) Texas Instruments – DRV2604L 2- to 5.2-V Haptic Driver for LRA and ERM with Internal Memory and Smart-Loop Architecture

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12 Device and Documentation Support
DRV2604L
SLOS866D – MAY 2014 – REVISED JUNE 2015
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
• Haptic Energy Consumption, SLOA194
• Haptic Implementation Considerations for Mobile and Wearable Devices, SLOA207
• LRA Actuators: How to Move Them?, SLOA209
• DRV2604L ERM, LRA Haptic Driver Evaluation Kit, SLOU390
• DRV2604LDGS Haptic Driver Mini Board, SLOU397
12.2 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
TouchSense is a registered trademark of Immersion Corporation.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2014–2015, Texas Instruments Incorporated
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